JPH0450744B2 - - Google Patents
Info
- Publication number
- JPH0450744B2 JPH0450744B2 JP61057439A JP5743986A JPH0450744B2 JP H0450744 B2 JPH0450744 B2 JP H0450744B2 JP 61057439 A JP61057439 A JP 61057439A JP 5743986 A JP5743986 A JP 5743986A JP H0450744 B2 JPH0450744 B2 JP H0450744B2
- Authority
- JP
- Japan
- Prior art keywords
- metal substrate
- copper plate
- oxide film
- layer
- aluminum oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 19
- 229910052802 copper Inorganic materials 0.000 claims description 17
- 239000010949 copper Substances 0.000 claims description 17
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 229920005989 resin Polymers 0.000 claims description 16
- 239000011347 resin Substances 0.000 claims description 16
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 12
- 239000004065 semiconductor Substances 0.000 claims description 10
- 229910001374 Invar Inorganic materials 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 description 9
- 238000000034 method Methods 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 150000001879 copper Chemical class 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61057439A JPS62214632A (ja) | 1986-03-14 | 1986-03-14 | 混成集積回路 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61057439A JPS62214632A (ja) | 1986-03-14 | 1986-03-14 | 混成集積回路 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62214632A JPS62214632A (ja) | 1987-09-21 |
| JPH0450744B2 true JPH0450744B2 (en]) | 1992-08-17 |
Family
ID=13055686
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61057439A Granted JPS62214632A (ja) | 1986-03-14 | 1986-03-14 | 混成集積回路 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62214632A (en]) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5130274A (en) * | 1991-04-05 | 1992-07-14 | International Business Machines Corporation | Copper alloy metallurgies for VLSI interconnection structures |
| DE4334127C1 (de) * | 1993-10-07 | 1995-03-23 | Mtu Muenchen Gmbh | Metallkernleiterplatte zum Einschieben in das Gehäuse eines Elektronikgerätes |
| KR101204191B1 (ko) * | 2010-11-02 | 2012-11-23 | 삼성전기주식회사 | 방열기판 |
| DE102015111667A1 (de) * | 2015-07-17 | 2017-01-19 | Rogers Germany Gmbh | Substrat für elektrische Schaltkreise und Verfahren zur Herstellung eines derartigen Substrates |
| CN210157469U (zh) * | 2018-12-29 | 2020-03-17 | 广东生益科技股份有限公司 | 金属基覆铜箔层压板 |
-
1986
- 1986-03-14 JP JP61057439A patent/JPS62214632A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62214632A (ja) | 1987-09-21 |
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